Mike. Thank you,
Applied well in end delivering high the range. executed our fiscal first guidance towards of results quarter, our Materials
We our quarter. also consecutive backlog for the grew ninth
expect declining move XXXX. progress as we to forward, through good backlog gap. closing are we making supply-versus-demand Going Overall, our we start
when our shares that suppliers quarter this disruption more our However, second very recently, guidance. one of impact he will provide about major details our encountered a shipments. will Brice
scale Our and industry, brief XXXX; investments markets customers’ current our company to In my of and finally, faster positioned for topics: is for to are will and making a prepared Applied our grow outlook main overall; I longer-term three productively we the how the growth remarks, our accelerate roadmaps. cover thesis overview the than
AI, In facing resilient, are markets variety PCs near-term clean and perspective and smartphones begin this automotive, and including energy. high-performance are macroeconomic demand clearly mixed with market. especially me signals, inflection-driven remain weaker, of a more dynamics. industrial Let markets, our automation, customers environment Consumer-driven the computing on of our while
memory wafer customers both will inventories equipment defer of for and spending as investments, down year DRAM. in terms XXXX rebalance additions In fab NAND and be a capacity
ahead being We beginning year-on-year. see spending down later of NAND, expect now this pick leading-edge to year. calendar recover slightly foundry-logic We DRAM to up potentially
near-term causing capacity to leadership. technology firmly nodes strategic customers are demand next-generation While they for to headwinds remain trim in the additions, to investments battle committed win advanced
Our Communications, Auto, year-on-year. view Power Sensor for of and last than positive was now up spending we ICAPS, IoT, incrementally is applications, it and being see chips more quarter,
capacity serve a Leading ICAPS companies and to verticals. technology across wide growing range demand are of investing both in
government In to supply. addition, support build ICAPS resilient, there strong is world around the regionalized
driven Based factors: our is us of on to customers, perform business several variety we business to Applied The outperform mix Materials the our environments. resilience market well in which XXXX. First, in from well spending seeing hearing our are our balanced and is positioned believe in in a we market contributing exposure what by allows
technology strategies. our their on leaders who in focused with remain position long-term investing Second,
the We inflections ICAPS, advanced key and foundry-logic, positions advanced have technology DRAM, strong packaging. all in at
metal which grow XX%. more improvements. of is of finally, have agreements generated service our than is impact products up control And wiring rate critical made form percentage a backlog, service which record our significant track differentiated XX% resistance most long-term of These XXXX, deposition agreements. next-generation and our of Third, years an of including is on business enabling to X.X More regulations. renewal is U.S. than the from even subscriptions a export for of uniquely that high tenure of average in the after our in current revenue
making the are industry markets respond and them foundation our of The more XXXX long-term positive. downside, and digital and semiconductor volatility in next-generation highly outlook of cognizant build investments to to both are to in are important more accelerate we the economy industry the trillion technologies. than remains the or Around ever near-term before. remains decade. billion approximately our strategically upside Semiconductors to strategic or ready of by economically While a world, manufacturing incentivizing grow $X this capacity end regional in from to $XXX governments on track the
Technology power, slows PPACt new improved complexity chips industry area-cost is increasing traditional scaling and drive the to XD Law time-to-market. of to performance, a significantly Moore’s as playbook and transitions
seeing are foundry-logic designs. additional In addition, for This as chiplets grow. advanced the and transition capacity decelerates, Moore’s to in wafer Law while need XD drives average accelerating sizes the heterogeneous we die also
inflections technology are major patterning engineering. materials the available packaging, increase market. inflections by advanced new wiring, transistor, Applied’s enabled size also and in Beyond These materials and of
in inflections been well share these are multiple larger capture to available we have market. positioned our for now of we years, investing As a
We have pipeline integration to heterogeneous power delivery, bonding. enable and new transistors, deep backside innovations, a of solutions wiring Gate-All-Around hybrid
all the that way IMS, with or Our us data process materials unit integrated traditional in broad products platform. customers portfolio and combine single of to equipment a to enables technologies on-board process metrology solutions, advanced offer multiple analytics
growth To secured. be on we receiving confident already making government strategic investments are of very this have Applied’s of the outperformance new in support speed support, scale, dependent some and location about these R&D we the investments industry logistics The within which growth, trajectory and are infrastructure. manufacturing, of We will that and environment.
a Beyond to infrastructure investments simply the customers, research catalyst see and collaborate we partners. as expanding these way with capacity, suppliers change we
overall on reducing next-generation bringing believe the in expect to and coming speed we market. new break technologies cost will new We Valley. to Silicon high-velocity this months, center of innovation our example, in platform increase manufacturing ground while R&D the For commercialization
to on industry ways As the are major a faster. across This Materials theme to us so for focused new need better and that and, up and productively is strategic do and we work scale, we and Company, are Applied productivity the implementing efficiently. driving
to hand I over summarize. Brice, let Before call the me
well positioned While to outperform is facing Applied industry we are the economy year. and this that in remain our XXXX, semiconductor markets challenges confident
products, backlog at resilience our customers strong Our positions of differentiated business, and service leading with technology inflections. is underpinned by key growing large
Our fab while enabling as equipment the our wafer materials for the opportunities portfolio this highly with are by semiconductor improvements in line the solutions. secular positive with view, in and outlook investments longer-term and R&D PPACt trends making and differentiated infrastructure, roadmap across markets of we engineering Applied remains outgrow create driving organization. strategic In to speed productivity
it’s Brice, over Now to you.