Thank you, Mike.
results range. well. our at the In third our high-end Across are executing business, delivered guidance our teams fiscal quarter, Materials the of Applied
We productively incremental technology and we customers. our scale driving operations introducing the solutions enabling are as our improvements we're products new our roadmap, and making in for company,
remarks today, across the with and Applied's driving innovation and my the our growth how I'll this In then era how of view I strategy us industry industry. summarize IoT-AI while prepared positioning picture is the big recent business this for start outgrow is also near-term over to I'll and longer-term. sustained outlook, year outperformance cover finally, including some this us And our enabling and the performance highlights. will
of are thesis as explaining wave expected having inflections and across of our well semiconductor new Applied later, Five growth IoT within we at AI out economy, summer sectors how impact the XXXX, profound innovation. industry. and a as the and Forum, drive semiconductor many In AI Design IoT a the of a to AI years laid
and coin. two are and sides infrastructure capable. vehicles, AI At all factories, buildings, computing same We view edge, smarter getting more consumer IoT and devices, the the of as
sales Power largest Communications, in serve of wafer that customers IoT, represent equipment the or fab these portion growing, are markets, and and Auto, XXXX. Sensors Our ICAPS,
Increasingly create be generation fueling explosion to primarily AI AI an hardware data intelligent are large is innovations. of can for very performance that training edge combined computing High by enabled then and datasets devices transmitted models.
a as roadmaps, which the new device becoming integration, of creates and well innovation As as is key designers. the leading-edge heterogeneous DRAM opportunities exciting logic AI result, for driver
In our summary, well part the significantly combination more drives of as for of is thesis and first as the technologies. that next-generation demand IoT silicon chips AI
chips The be of those and second will to part thesis technology our supplied. relates innovations how new
to down, structures, to in The and as new Area-Cost benefits elements: traditional is heterogenous industry technology, to moving new new architectures, device of key new the scaling materials, new terms XD the a drive of playbook five playbook has slow ways integration. and In Law and improvements PPACt shrink, time-to-market. Moore's XD system Performance, Power,
key the in positive of enabled new in to increasingly transition Distribution transistors Power Gate-All-Around where two The Backside examples in include to for Key materials First, playbook by advances as Applied and logic. evolves, ways: Applied the roadmap differentiated is advanced move capabilities. is has the this engineering it
complex, solutions, volume more as ramp, technology customers complexity more as and integrated providing we by which and well inherently manage Second, is cost yield comprehensive R&D, transfer, can advanced the and PPACt playbook accelerate to products in help services include this production.
countries In industry to of seek regionalization being economies. that to capacity are supply to their support build also playbook semiconductor parallel new seeing local the are we verticals resilient implemented, PPACt essential to as chains,
next globally As over incentives will of a the be billions deployed of hundreds dollars years. of five government result,
ICAPS on organization the released applications. past to new created five products than these organization, dedicated more and At early profile. Applied, we to ICAPS recognized XX we a market and made and the investment focus for important strategy, trends changes our years, In
products and for relationships to market integrated differentiated We deeper products, leading-edge This co-optimized highly our resulted and with also memory. logic strategic new formed a accelerate increasing has much customers, team solutions share. and on in focused
that We share fueling a in and, very generations developed and gains to leadership advanced market this clear packaging. integration a strong segment outperformance contributing portfolio in technology of to our enable products is and heterogenous we of multiple established position DRAM
five In integration fact, we West just announced products new at SEMICON heterogenous in July.
investment deliver increased to value on-going in outperformance during period AI-driven makers. in XXXX, enabled IoT very even by performance us and and and strategy has This also on It positions and of more strong focus inflections customers us low a for XXXX beyond. memory to
me areas. a Let few highlight key
were than the first equipment of process closest peers in two half combined. higher revenues our our DRAM, XXXX In
DRAM Our is factors. strength in underpinned by multiple
share significant EUV-based DRAM both gained multi-patterning. have patterning, and for We in
for We which enabler capacitor solutions, scaling. are have hardmask developed unique, key a co-optimized
Via We high-bandwidth memory. supplier of advanced generations have packaging significantly multiple for circuitry I/O they that in developed to are peripheral where in positions Through key largest of we logic and DRAM, the increase enable And, successfully technologies used ported with are Silicon speed. to the micro-bump leadership solutions
investments very DRAM grow X% DRAM less growth annual rate compound years. our especially feel As but about is of it memory increase, the in for XX% positive today, at DRAM coming is High-bandwidth high-performance we opportunities, capacity than a datacenter. over to the expected
needed larger increase area and at extra die-stacking steps of top die it you a the because compared for If the processing X%. On of by approximately our further look to routing is HBMX available additional for XX% needed the TSVs. DDRX, this, total about I/O market
include and We beneficiary which these for significant demand of a government electric systems, driver key technology as investments we advanced ICAPS energy, expect of to to wind customers ICAPS the drive to requires be and smart automation, business. assistance underpinned that are billion annual each could ICAPS chips, delivering expected regional end around are power $X,XXX by Another of with vehicles, the generated grid, driver markets also sustainable $X,XXX the industrial These silicon world, the and is will decade. enabling solar support play $XX where the incentives. demand over vehicles of these out megawatt global by be growth inflections decade. as large, see our next and
geographic absorbing of XX%. rate subscriptions renewal utilization the base are needed revenue agreements. are drivers after a trade track agreements is of on The our impact and is increasing quarter both footprint, in of PPACt key and our long-term from XX% the than U.S. this to and record have the rates of This service generated a industry's form at These to more this than rate installed a year, growing playbook with faster than more of business. new high rules. low revenue year's combined XXXX complexity enable fab delivered growth service grow with the AGS the even for broadening in
years. services customer capabilities, of achieve strong low our a growth pipeline the and to we're for With on-track robust in AGS new pull we coming believe double-digit
about cost velocity through carbon relating I significant next-generation Applied, While believe closer and efficient is important deliver combined to ahead, and of the to commercialization we industry that computing. excited it way collaboration our to challenges recognize this complexity, innovation this future, am footprint. opportunities also and energy overcome must higher the technology the At is do to for
productivity. better government Engineering and suppliers the quarter, investments EPIC accelerate support increasing States These we time-to-innovation platform announced to partners in United the our In universities, major faster initiatives: and in will relationships while Center India. and and Collaborative even two a combined our customers, R&D time-to-commercialization with past
optimize we as emissions and to the as we new out by and as to reduce much by Net our Vistara industry EcoTwin, by driving approach carbon with increases July, our carbon and chemical a Zero help and by throughput consumption recipe. announced reductions: two products density customers model up In are also consumption platform, and which rolled tool XX% In energy major that addition, energy enables lowers monitor, that platform XX%, we and to grows. collaborative collaborative playbook customers
inflections. takes hand a investments over to high-value summarize. quickly of and wave shape, of Applied, focused as at strategy to me the for global we and deliver At and, semiconductor I key are IoT-AI and call Before the AI-driven it major driving is our the IoT technologies growth industry. chips inflections have Advanced enable new the innovation let foundation that Brice, era
ICAPS, foundry-logic, equipment positions XXXX, deliver sustainable coming the results years. for over strong DRAM, heterogenous strategy positions advanced to and lower have in strong overall us packaging. fab using leadership We consistently and outperformance This despite leading-edge is us spending, enabling wafer integration in
Brice, it's over you. to Now,