Types of Semiconductors We Manufacture.
We manufacture different types of semiconductors with different specific functions by changing the number and the combinations of conducting, insulating and semiconducting layers and by defining different patterns in which such layers are applied on the wafer. At any given point in time, there are thousands of different products in various stages of fabrication at our fabs. We believe that the keys to maintaining high production quality and utilization rates are our effective management and control of the manufacturing process technologies which comes from our extensive experience as the longest existing dedicated foundry and our dedication to quality control and process improvements. Our semiconductors are used for a variety of different platforms. The principal platforms include:
We offer leading process technologies such as
4-nanometer
Fin Field-Effect Transistor (“FinFET”) and
5-nanometer
FinFET logic process technologies, as well as comprehensive intellectual properties for premium product applications to further enhance chip performance, reduce power consumption, and decrease chip size. For mainstream product applications, we offer a broad range of logic process technologies, including
6-nanometer
FinFET,
7-nanometer
FinFET plus,
7-nanometer
FinFET,
12-nanometer
FinFET compact plus (“12FFC+”),
12-nanometer
FinFET compact (“12FFC”),
16-nanometer
FinFET compact plus (“16FFC+”),
16-nanometer
FinFET compact (“16FFC”),
28-nanometer
high performance compact (“HPC”),
28-nanometer
high performance mobile compact plus (“28HPC+”), and
22-nanometer
ultra-low
power (“22ULP”) logic process technologies, in addition to comprehensive intellectual properties, to satisfy customer needs for high-performance and
low-power
chips. Furthermore, for premium and mainstream product applications, we offer highly competitive, leading-edge specialty technologies to deliver specialty companion chips for customers’ logic application processors, including RF, embedded flash memory, emerging memory technologies, power management, sensors, and display chips, as well as advanced TSMC 3DFabric
TM
packaging technologies such as the leading integrated
fan-out
(“InFO”) technology.
High Performance Computing Platform:
Driven by data explosion and application innovation, high performance computing has become one of the key growth drivers for our business. We provide customers, both fabless IC design companies and system companies, with leading-edge process technologies such as
4-nanometer
FinFET,
5-nanometer
FinFET,
6-nanometer
FinFET,
7-nanometer
FinFET and
12-nanometer/
16-nanometer
FinFET, as well as comprehensive intellectual properties including high-speed interconnect intellectual properties to meet customers’ product requirements for transferring and processing vast amounts of data anywhere and anytime. In particular, we introduced our first
HPC-focused
technology, N4X, representing the ultimate performance and maximum clock frequencies in our
5-nanometer
family. Based on advanced process nodes, a variety of high performance computing products have been launched, such as central processing units (CPUs), graphics processor units (GPUs), field programmable gate arrays (FPGAs), server processors, accelerators, high-speed networking chips, etc. Those products can be used in current and future 5G, AI, cloud, and data centers. We also offer multiple advanced TSMC 3DFabric
TM
packaging technologies, such as CoWoS
®
, InFO, and TSMC-SoIC
TM
, to enable homogeneous and heterogeneous chip integration to meet customers’ requirements for high performance, high compute density and efficiency, low latency and high integration. We will continue to optimize our high performance computing platform and strengthen collaboration with customers to help customers capture market growth in high performance computing markets.
We provide leading, comprehensive, and highly integrated
ultra-low
power (“ULP”) technology platforms to enable innovations for artificial intelligence (“AI”) of things (“AIoT”, AI+ IoT) applications. Our offerings include the new FinFET-based
12-nanometer
technology—N12e
TM
featuring energy efficiency with high performance that results in more computing power and AI inferencing,
22-nanometer
ultra-low
leakage (“ULL”),
28-nanometer
ULP,
40-nanometer
ULP, and
55-nanometer
ULP, which have been widely adopted by various edge AI
(“SoC”) and battery-powered applications. We also extend our low Vdd (low operating voltage) offerings with wide-range operating voltage simulation program with integrated circuit emphasis (SPICE) models for extreme
low-power
applications. We also offer competitive and comprehensive specialty technologies in RF, enhanced analog devices, embedded flash memory, emerging memory, sensors, and display chips, as well as multiple TSMC 3DFabric
TM
advanced packaging technologies, including leading InFO technology, to support the fast-growing demand in AIoT edge computing and wireless connectivity.
Our Automotive Platform provides a comprehensive spectrum of technologies and services to support the three megatrends – safer, smarter and greener – in the automotive industry. We are also an industry leader in providing a robust automotive intellectual property ecosystem, which covers
16-nanometer
FinFET and
7-nanometer
FinFET technologies and extends to
5-nanometer
FinFET technology, for advanced driver-assistance systems (“ADAS”), advanced
in-vehicle
infotainment (“IVI”), as well as zonal controllers for new electrical/electronic (“E/E”) architecture for the automotive industry. In addition to the advanced logic technology platform, we offer a broad array of competitive specialty technologies, including
28-nanometer
embedded flash memory,
28-,
22-
and
16-nanometer
millimeter wave RF, high sensitivity CMOS Image/Lidar (light detection and ranging) sensors, and power management integrated circuit (“PMIC”). Magnetic random access memory (“MRAM”), an emerging technology, has demonstrated automotive
Grade-1
capability on
22-nanometer
and is under development with good progress on
16-nanometer
to meet automotive
Grade-1
requirements. All these automotive technologies are applied to our automotive process qualification standards based on
AEC-Q100
standards or meeting our customers’ technology specifications.